[Problem Solving Case Study] Application Report (Vol. 63)
Improved heat dissipation efficiency through the adoption of resin mold packaging! Introduction of problem-solving examples.
At Orinas Co., Ltd., we are always committed to providing "faster responses," "more accurate responses," and "excellent proposals" to meet our customers' needs, contributing to the creation of added value for our customers. This report introduces examples of problem-solving for our customers. If you are having trouble selecting electronic devices, please feel free to consult us. 【Case Study】 ■ Key factors in customer adoption - Adoption of resin molded packages, resulting in reduced thermal design workload ■ Benefits for customers - Reduced thermal design workload ■ Customer product: Coin hopper *For more details, please refer to the PDF document or feel free to contact us.
- Company:オリナス 東京営業所、名古屋営業所、京都営業所、大阪営業所、香港
- Price:Other